Toshiba & Elixent Agree to Jointly Develop Reconfigurable Platform SoCs; First Platform Device to Be Available in 2003
BRISTOL, England--(BUSINESS WIRE)--Jan. 27, 2003--Elixent has
entered into an agreement with Toshiba to jointly develop a platform
System-on-Chip (SoC) that integrates Elixent's D-Fabrix reconfigurable
algorithm processing array with Toshiba's MeP configurable processor
core (http://www.mepcore.com). This SoC will be used as a
reconfigurable evaluation and development platform by both companies.
The D-Fabrix array will be used to accelerate algorithm processing
and provide dynamic reconfigurability within the platform. The
resulting platform SoC will be useful for the implementation of a
broad range of consumer applications, combining the benefits of
Toshiba's MeP processor and Elixent's reconfigurable technology.
With rapidly rising mask set costs being incurred due to the move
to 90nm and 65nm, a different technique is essential for
cost-effective production. Elixent's reconfigurable technology will
help semiconductor companies maintain their lead on the cutting edge
processes needed to manufacture SoCs at these new geometries.
"We evaluated many solutions before choosing Elixent," said Dr
Furuyama, General Manager of Toshiba's SoC Research and Development
Center. "D-Fabrix is the reconfigurable algorithm processor that will
well fit with Toshiba's MeP platform and thus will efficiently provide
various benefits."
The combination of dynamic reconfiguration and changing the
algorithm processing architecture on-the-fly under the control of
Toshiba's MeP processor delivers substantial savings in cost and
power. It produces a completely programmable device with performance
exceeding that of the fastest DSPs.
"We are convinced that this technology will trigger substantial
change in the industry", commented Kenn Lamb, Elixent's CEO. "From the
earliest development of D-Fabrix, starting over six years ago at HP
Labs, it was apparent that the potential cost, speed and power
consumption benefits would make it a winning solution," he continued.
"This announcement shows how right we were and we are very excited
about this agreement with Toshiba."
About Elixent's reconfigurable algorithm processing architecture
Elixent's D-Fabrix RAP platform implements algorithms in "Virtual
Hardware", allowing the creation of a hardware accelerator for every
algorithm in a system. By virtue of reconfigurability, it can
implement multiple hardware accelerators in the same silicon area,
giving high silicon utilisation. Further, this reconfigurability
allows functionality to be added or changed post-fabrication, allowing
bugs to be fixed, new functions to be added, or even the whole chip to
be customised.
It achieves this by mapping algorithms to a fine-grained
processing array made up of ALUs, registers and memories, giving it a
unique ability to adapt to any algorithm or datapath width. This
provides the flexibility of a software solution with the performance
of a hardwired ASIC.
Through dynamic reconfiguration Elixent's D-Fabrix array allows
for a high degree of silicon reuse, leading to lower device cost. In
benchmarks against standard DSP processors, D-Fabrix provides 10x the
performance in less silicon area - and with greatly reduced power
consumption. Additionally, D-Fabrix enables a new class of platform
devices that can be truly multi-functional - supporting multiple
applications, and adapting efficiently to changing specifications.
About Elixent
Elixent is a leader in reconfigurable semiconductor IP. D-Fabrix,
the company's patented reconfigurable algorithm processing (RAP)
technology provides solutions for companies producing electronic
products for imaging and communications applications in consumer and
industrial markets. Visit www.elixent.com for more information.
For more information please contact:
Ralph Weir, Elixent, Castlemead, Lower Castle Street, Bristol, BS1
3AG, UK
Tel: +44 (0)117 917 5762, email: ralph.weir@elixent.com
For press enquiries please contact:
Matt Wilson, EML, The Albany Boathouse, Lower Ham Road, Kingston
upon Thames, Surrey, KT2 5BB, UK
Tel: +44 (0)20 8408 8000, email: mattw@eml.com
Editorial Backgrounder
Why Reconfigurable Is the Hottest Topic in Semiconductors
Early 2003 (a) will see the first commercial chips produced on 90nm
processes, representing a 4x density increase from the last-generation
0.18u process - and double the current leading-edge process of 0.13u.
At 90nm, the cost of a mask set is approximately SIX TIMES higher than
at 0.18u. (b)
At the same time, cutting-edge fabs are moving to a 300mm wafer -
giving approximately double the number of devices per wafer as the
last generation 200mm fabs.
This combination has been portrayed as a killer blow for the
semiconductor industry. A 6x increase in mask charges raises the point
at which it is viable to produce an ASIC or SoC; and when combined
with the vastly increased number of devices yielded per wafer lot,
it's easy to see why ASIC starts have been falling drastically.
However there is a solution - the reconfigurable "platform SoC".
This contains a blend of programmable components, such as a RISC and a
Reconfigurable Algorithm Processor, possibly with some interfaces
specific to one market. Such an SoC can be reconfigured to serve
multiple markets. This has two main benefits:
|
-- | The mask charge is now shared between multiple projects.
Aggregating the volume of multiple projects in this way allows
SoCs to be financially justified.
|
-- | The SoC is now entirely programmable. Very little is specified
in hardware; thus, it is very likely that should a bug be
found, or a specification be varied, a solution can be found
that does not necessitate a new chip - and a new mask charge.
|
Reconfigurable Algorithm Processing has many further benefits that
reduce unit cost - such as the concept of Dynamic Reconfigurability.
Used this way, a single small piece of silicon performs many functions
that would otherwise require multiple hardware engines - resulting in
a smaller die.
While these latter reasons make reconfigurable technology
attractive, the compelling reason is the exponentially increasing mask
charges that SoC developers face. Without reconfigurable technology,
there may be no SoC business at the 65nm node. This motivation is what
is driving the world's top semiconductor companies to identify
reconfigurable solutions - as a matter of urgency.
(a) Based on releases from Xilinx, IBM & TSMC amongst others...
(b) All numerical data from Jeremey Donovan - Vice President and
Chief Analyst at Gartner Dataquest. Online analysis at
http://www.eet.com/comm/c/mw/OEG20021118S0021
CONTACT: Elixent, Bristol
Ralph Weir
Tel: +44 (0)117 917 5762
email: ralph.weir@elixent.com
or
For press enquiries
EML
Matt Wilson
Tel: +44 (0)20 8408 8000
email: mattw@eml.com